HANMI Semiconductor Secures 44.2 Billion KRW Order from SK Hynix for HBM4 TC BONDER 4.5 GRIFFIN, Boosting Revenue Outlook
HANMI Semiconductor has signed a contract with SK Hynix to supply TC BONDER 4.5 GRIFFIN equipment for HBM4 manufacturing, with a contract value of 44.2 billion KRW representing 7.66% of its 2025 consolidated revenue.
The contract period runs from June 8, 2026 to September 2, 2026, with no upfront payment; payment will be received after delivery.
This order, involving high-value HBM4 process equipment, reaffirms HANMI Semiconductor's technological leadership and market position, and is expected to positively impact future revenue growth and profitability.
[AI Summary]HANMI Semiconductor's order from SK Hynix for core HBM4 equipment validates its technological edge. The 44.2 billion KRW contract will directly contribute to 2026 revenue, benefiting from the customer's next-gen memory investment expansion. Without any capital structure changes, this strengthens operating cash generation, enhancing shareholder value.