HANMI Semiconductor Holds IR Meeting for 2026 H2 Outlook and New Market Entry
HANMI Semiconductor disclosed on June 1 that it will hold an IR meeting for domestic institutional investors in Seoul on June 4, 2026
Key topics include 2026 H2 outlook and new overseas market entry, with plans to launch 2.5D package TC bonders (40·120) targeting AI system semiconductor market (foundry, OSAT)
For the HBF (High Bandwidth Flash) market, a new concept TC bonder is planned to meet expanding AI semiconductor memory demand
Participation in the US-led AI semiconductor alliance to collaborate with big tech, memory, and foundry companies, addressing AI packaging equipment demand
The IR schedule may change due to company circumstances; no other related disclosures
[AI Summary]This disclosure is a routine IR announcement with no immediate financial impact, but the plans to expand into AI semiconductor packaging and new technologies (2.5D, HBF) could provide positive momentum for the stock price