Hanmi Semiconductor Participates in Macquarie Asia Conference, Announces AI Semiconductor Market Entry Plans
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• Hanmi Semiconductor participates in 'Macquarie Asia Conference 2026' in Hong Kong on May 18-20, 2026
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• Entry into AI system semiconductor (foundry, OSAT) market: plans to launch 2.5D Package TC bonder (40·120)
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• Entry into HBF (High Bandwidth Flash) market: new concept TC bonder to meet AI semiconductor memory demand
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• Entry into US-led AI semiconductor market: joining Big Tech, memory, foundry alliance to address AI package equipment demand
KOSPI Filing Information
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Filing: Corporate Briefing (IR) Holding (Notice Disclosure)
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Company: HANMI Semiconductor (042700)
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Submission: HANMI Semiconductor
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Receipt: 05-15-2026
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Under KRX KOSPI Market Division