Daishin Securities Completes Issuance of ELB Series 1123 and 1124, Raising Approximately KRW 9 Billion
Daishin Securities completed the issuance of its 1123rd and 1124th Equity-Linked Bonds ELB on July 16, 2026, raising a total of KRW 8,995.5 million. Each series consisted of 400,000 and 500,000 units respectively, issued at KRW 9,995 per unit against a face value of KRW 10,000, representing a slight discount.
The proceeds will be fully used for hedging the derivative liabilities of the respective ELB products, with the underlying asset being Samsung Electronics common stock. The 1123rd series offers a yield of approximately 3.89% to 3.90% with a 186-day maturity, while the 1124th series offers 4.04% to 4.05% with a 369-day maturity.
This report confirms the subscription and allocation results following the effectiveness of the securities registration statement. The issuance is a debt financing activity with no impact on existing equity, thus limiting direct effects on shareholder value. Daishin Securities plans to manage market volatility through stable funding and hedging operations.
[AI Summary]Daishin Securities' ELB issuance is a debt financing without any change in common shares, posing no dilution risk to existing shareholders. The funds are allocated to hedging activities, reflecting a conservative financial strategy. The impact from underlying Samsung Electronics stock price fluctuations is limited. Daishin maintains good creditworthiness and regulatory compliance, preserving investor confidence.