DAISHIN SECURITIES Issues ELB Series 1107 Raising 19.98 Billion KRW for Hedging
DAISHIN SECURITIES is publicly offering the 1107th series Equity Linked Bond ELB with low risk based on Samsung Electronics common stock, totaling 19.98 billion KRW.
The bond has a face value of 10,000 KRW per security, an issue price of 9,990 KRW, with 2 million units issued, a maturity of 181 days, and an annual return of 3.5% in a principal-protected structure.
Proceeds will be used for hedging underlying assets and derivatives, as well as investing in financial products; the issuer's credit rating is AA- from multiple agencies.
DAISHIN SECURITIES filed a shelf registration of 20 trillion KRW in December 2025, and this issuance is part of that program; the bond is unlisted and not protected by deposit insurance.
[AI Summary]DAISHIN SECURITIES' 1107th ELB issuance is a debt-linked derivative for hedging purposes without diluting existing shareholders. The offering size is negligible relative to market cap, and the issuer's credit quality is sound, but the unlisted nature limits liquidity and early redemption may incur principal loss.