Daishin Securities issued its 1108th equity-linked bond on June 29, 2026, raising 29.97 billion KRW. The underlying asset is Samsung Electronics common stock, maturing on December 29, 2026, with an annual yield of 3.50%.
This bond is not protected by the Depositor Protection Act and carries potential loss of principal. The issuer Daishin Securities has a credit rating of AA-, but as an unsecured bond, repayment depends on the issuer's solvency.
The proceeds will be used for hedging transactions in underlying assets and derivatives to ensure stable repayment, as well as investment in financial products.
The bond is unlisted, and early redemption may occur at 95% of fair value, possibly resulting in principal loss. If total subscriptions are below 1 billion KRW, the issuance may be canceled.
[AI Summary]This ELB issuance by Daishin Securities is a debt financing with no equity dilution, but it increases financial leverage slightly. The use of funds for hedging and investment is neutral for growth, with limited impact on stock price. The issuer's AA- credit rating indicates low credit risk, but the unlisted nature poses liquidity risk.