HANMI Semiconductor to Hold Overseas IR Led by Merrill Lynch Presenting AI Semiconductor Market Entry Strategy
HANMI Semiconductor will participate in the '2026 Asia Conference in New York' sponsored by Merrill Lynch from June 8 to 10, 2026 in New York, USA, holding one-on-one and group meetings with major overseas institutional investors.
During this IR, HANMI Semiconductor plans to announce the launch of a 2.5D package TC Bonder for AI system semiconductor market entry and a new concept TC Bonder targeting the HBF market. It will also respond to AI package equipment demand by participating in the US-led AI semiconductor alliance.
No capital changes or shareholder return policies are included, and the schedule is subject to change.
[AI Summary]HANMI Semiconductor holds an IR presenting its AI semiconductor market entry strategy to overseas institutions, hosted by global investment bank Merrill Lynch. With no capital changes, there is no direct impact on existing shareholder value, but the new market entry plans could positively affect future growth. The high credibility of the sponsor is positive from a governance perspective, making this a neutral event overall.