Mirae Asset Securities Issuance of KRW 5 Billion Samsung Electronics-Linked ELB: Routine Funding with No Shareholder Value Impact
Mirae Asset Securities issued its 3979th Equity-Linked Bond (ELB) linked to Samsung Electronics common stock, with a total offering amount of KRW 5 billion.
The ELB has a face value of KRW 10,000 per security, issued at par, totaling 500,000 securities. The bonds are non-listed and issued via electronic registration.
Monthly coupon condition: If the underlying asset's closing price on each monthly evaluation date is at least 70% of the initial reference price, investors receive a monthly return of 0.77% (9.24% p.a.), offering relatively high interest income.
Automatic early redemption: There are 11 early redemption observation dates; if the underlying price is at least 85% of the initial reference price, the bond is redeemed at 100% of face value.
Maturity: On the maturity evaluation date (May 29, 2029), regardless of whether the underlying price is above or below 85% of the initial reference price, investors receive 100% of face value, ensuring principal protection.
The raised funds will be used for hedging purposes, including purchasing high-quality bonds and executing derivative transactions, to ensure stable repayment at maturity.
The issuance cost is only KRW 250,000 underwriting fee, which is negligible relative to the offering size.
[AI Comprehensive Analysis]This disclosure is a routine report on the issuance of structured products by Mirae Asset Securities. It does not cause shareholder dilution or changes in financial structure, and is assessed as a neutral event.