Mirae Asset Securities Issues KRW 20 Billion in Equity-Linked Bonds (ELB) Linked to KOSPI200 and Samsung Electronics for Hedging Purposes
On May 27, 2026, Mirae Asset Securities filed supplementary documents for the public offering of its 3981st and 3982nd series Equity-Linked Bonds (ELB), each worth KRW 10 billion, totaling KRW 20 billion.
These ELBs are linked to the KOSPI200 index and Samsung Electronics common stock, offering at least principal repayment at maturity (approx. 3.33% p.a. for series 3981 and 3.58% p.a. for series 3982), classified as low risk (grade 6).
Subscriptions are limited to retirement pension accounts, conducted on May 29, 2026 only. The securities are unlisted and early redemption may result in principal loss.
Proceeds will be used for hedging transactions and investments in financial products to ensure stable repayment.
[AI Comprehensive Analysis]This ELB issuance is a routine funding activity for Mirae Asset Securities with no direct impact on shareholder value. The issuance size is negligible relative to market cap (approx. KRW 37.8 trillion), and there is no equity dilution or dividend policy change, limiting any short-term stock price effect.