Korean Market
ISSU
Kyobo Securities
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Kyobo Securities Issues 100 Billion KRW Principal-Guaranteed Equity-Linked Bonds Linked to Samsung Electronics and SK Hynix, No Dilution for Existing Shareholders

 
ISSU
Kyobo Securities
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Kyobo Securities Issues Three Principal-Protected Equity-Linked Bonds Totaling 29.79 Billion KRW: Coupons Linked to Stock Performance with Principal Guarantee at Maturity

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 29.79 Billion KRW in Three Series of Equity-Linked Securities, No Share Dilution as Proceeds Used for Hedging

 
ISSU
Kyobo Securities
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Kyobo Securities ELB Issuance Only 46% Subscribed; Proceeds Used for Hedging

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 10 Billion Won in Equity-Linked Bonds with Principal Protection, No Dilution Impact

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 10 Billion Won ELB Linked to KEPCO, No Shareholder Dilution

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 20 Billion KRW Equity-Linked Bond: Neutral Capital Raising Without Dilution

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 20 Billion Won ELB Linked to KEPCO for Hedging, No Shareholder Dilution

 
ISSU
Kyobo Securities
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Kyobo Securities Low Subscription Rate for 12547th Derivative Bond Reflects Weak Demand, Minimal Impact on Shareholder Value

 
ISSU
Kyobo Securities
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Kyobo Securities Issued 4.66 Billion KRW in Equity-Linked Derivative Bonds for Hedging Purposes

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 1.61 Billion KRW in ELS Bonds with Low Subscription Rate; Limited Impact on Shareholder Value

 
ISSU
Kyobo Securities
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Kyobo Securities 50252nd Equity-Linked Derivative Bond Correction Filing, No Capital Change and Limited Impact on Shareholder Value

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 100 Billion Won Equity-Linked Bond, Proceeds for Hedging with No Shareholder Dilution

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 100 Billion KRW Equity-Linked Bond Linked to KEPCO, Low-Risk Product with Limited Shareholder Value Impact

 
ISSU
Kyobo Securities
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Kyobo Securities Issues 50251st Series Equity-Linked Derivative Bond Only 28.39% of Planned Amount Subscribed Funds Allocated for Hedging Activities