Korean Market
ISSU
DAISHIN SECURITIES
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DAISHIN SECURITIES Issues 49.95 Billion Won ELS #1086 with 3.3% Return

 
ISSU
DAISHIN SECURITIES
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Issuance of 19.98 Billion Won Derivative-Linked Bonds (Low Risk)

 
ISSU
DAISHIN SECURITIES
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Issuance of 4.995 Billion Won Low-Risk Derivative Bond (Max 3.30% p.a.)

 
EXCH
DAISHIN SECURITIES
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Major Shareholder Stake Increases 0.02% via Insider Purchase

 
OWNR
DAISHIN SECURITIES
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Submission of Report on Ownership of Specific Securities by Executives and Major Shareholders (No Changes)

 
ISSU
DAISHIN SECURITIES
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Planned issuance of ELB 167~169 totaling KRW 350 billion (low risk)

 
ISSU
DAISHIN SECURITIES
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Issuance of 350 Billion Won KOSPI200-Linked ELB (Annual 3.4-3.7%)

 
ISSU
DAISHIN SECURITIES
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Issuance Results of Daishin Securities 362nd & 363rd Other Derivative-Linked Bonds (Shortfall Fully Subscribed)

 
ISSU
DAISHIN SECURITIES
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ELB 1086th Series: Actual Issuance of 2 Billion Won Due to Under-Subscription

 
OWNR
DAISHIN SECURITIES
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Correction of Officer Status Disclosure

 
ISSU
DAISHIN SECURITIES
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Additional Issuance of Two Low-Risk Samsung Electronics-Linked ELBs Totaling KRW 99.85 Billion

 
ISSU
DAISHIN SECURITIES
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Issuance of 99.85 Billion Won Samsung ELS with Up to 3.2% Annual Return

 
ISSU
DAISHIN SECURITIES
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Issuance of 20 Billion Won Samsung Electronics-Linked Derivative Bond with 3.1% Annual Yield

 
ISSU
DAISHIN SECURITIES
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KRW 200 Billion 181-Day Equity-Linked Derivative Bond Issuance, 3.10%-3.11% Yield at Maturity

 
ISSU
DAISHIN SECURITIES
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Daishin Securities Corrective Filing for Derivative-Linked Bonds (Reference Update & CEO Change)