Mirae Asset Securities Finalizes Issuance of 4034th Equity-Linked Bond Worth 19.9 Billion Won AA Credit Rating and Strong Capital Base
Mirae Asset Securities has finalized the issuance of its 4034th Equity-Linked Bond ELB linked to Samsung Electronics common stock through an additional registration statement filed with the Financial Services Commission on July 15 2026.
The total offering amounts to 19.9 billion won with an issue price of 9,950 won per bond for 2 million securities maturing on July 31 2029. The structure offers automatic early redemption and principal protection at maturity if the underlying asset closes below 65% of the initial price.
The proceeds will be used for hedging transactions including trading in underlying assets and derivatives as well as investments in financial products to ensure stable repayment.
Mirae Asset Securities holds a AA credit rating from NICE KIS and KIB with a consolidated net capital ratio NCR of 3,437.05 significantly above regulatory requirements.
In 2025 the company acquired 80.1 billion won of treasury shares and cancelled 175.2 billion won. In January 2026 it announced a plan to acquire and cancel an additional 100 billion won in treasury shares. A cash dividend of 300 won per common share was also declared for 2025.
These securities are not covered by the Depositor Protection Act and will not be listed on an exchange which may limit liquidity.
[AI Summary]The issuance of Mirae Asset Securities 4034th ELB is a 19.9 billion won unsecured debt offering with a principal-protected structure backed by the AA credit rating of the issuer. No capital dilution occurs for existing shareholders but liquidity risk exists due to non-listing and lack of deposit insurance. Strong financial soundness and active share buyback and cancellation policies are positive for shareholder returns.