Daishin Securities Prospectus for Series 1123 and 1124 ELBs Becomes Effective, Raising Approximately KRW 9 Billion for Hedging
The prospectus for Daishin Securities' Equity-Linked Bonds Series 1123 and 1124 became effective on July 14, 2026.
Series 1123 amounts to KRW 3.998 billion, linked to Samsung Electronics common stock, with a 186-day maturity offering an annual return of 3.89% to 3.90%.
Series 1124 amounts to KRW 4.9975 billion, same underlying asset, 369-day maturity, offering 4.04% to 4.05% annual return.
Proceeds will be used for hedging underlying assets and investing in financial products.
These bonds are not protected by the Depositor Protection Act and are unlisted, limiting liquidity.
[AI Summary]This ELB issuance by Daishin Securities is a routine debt fundraising of about KRW 9 billion with no equity dilution, thus limited direct impact on shareholder value. The issuer's AA- credit rating indicates sound credibility, but investors should be aware of potential principal loss and early redemption risks.