Mirae Corporation has signed a semiconductor inspection equipment supply contract with YILING TRADING of China. The contract amounts to approximately 6.22 billion KRW, representing 12.25% of its 2025 consolidated revenue.
Payment terms are 70% advance payment before shipment and 30% after final approval, with the contract period from June 23, 2026 to November 20, 2026.
This order expands Mirae Corporation's core semiconductor equipment business and is expected to positively impact 2026 earnings. However, the lack of detailed credit information on YILING TRADING introduces counterparty risk.
[AI Summary]This supply contract for semiconductor inspection equipment is highly aligned with Mirae Corporation's core business and contributes over 12% of revenue, potentially boosting the stock price. However, low counterparty transparency and high advance payment ratio require monitoring of execution risk.