Mirae Asset Securities Issues 39.8 Billion KRW in Samsung Electronics-Linked Derivative Bonds Capital Raising for Hedging and Investment


  • Mirae Asset Securities will issue the 4002nd and 4003rd equity-linked derivative bonds totaling 39.8 billion KRW through a subscription on June 22, 2026, with each series raising 19.9 billion KRW.
  • Each bond is linked to Samsung Electronics common stock with a 3-year maturity and auto-call features, offering a principal-protected structure with maximum annual returns of 6.80% or 7.70%, but not covered by depositor protection.
  • Proceeds will be used for underlying asset trading, derivatives hedging, and financial investment to ensure stable repayment under the bond terms.
  • The issuer Mirae Asset Securities has a credit rating of AA, but the bonds are unlisted, posing liquidity risk and potential principal loss upon early redemption.
  • [AI Summary]This 39.8 billion KRW ELB issuance is a routine capital market activity with no direct impact on shareholder value as funds are used solely for hedging and investment. The principal-protected structure limits downside risk to issuer creditworthiness, but the lack of listing reduces liquidity, making it suitable for long-term investors.

KOSPI Filing Information


  • Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
  • Company: Mirae Asset Securities (006800)
  • Submission: Mirae Asset Securities Co., Ltd.

  • Shares: 559,566,880
  • Price: 49,750 KRW
  • Market Cap: 27,838.5 B KRW