Mirae Asset Securities Issue of 3974th ELB: Subscriptions of 5.3 Billion Won out of 10 Billion (5.31%)
Mirae Asset Securities issued the 3974th Equity-Linked Bond (ELB): Only 5.31% (5.3 billion won) of the total 10 billion won was subscribed, resulting in partial payment
Underlying assets: KOSPI200 Index and Samsung Electronics common stock, maturity 364 days, unlisted
Proceeds will be used for hedging of maturity redemption via high-quality bonds and derivatives trading