Mirae Asset Securities Issuance of 3979th ELB (Equity-Linked Bond) Worth KRW 5 Billion - Linked to Samsung Electronics, Non-Principal Protected
Mirae Asset Securities publicly offers the 3979th series Equity-Linked Bond (ELB) linked to Samsung Electronics common stock, with total issuance of KRW 5 billion
Face value and issue price per bond: KRW 10,000; total 500,000 bonds; maturity date May 31, 2029; unlisted
Monthly coupon condition: if closing price on each monthly observation date is at least 70% of initial price, pay 0.77% per month (9.24% p.a.) before tax
Automatic early redemption: if closing price on any observation date is at least 85% of initial price, pay 100% of face value; up to 11 opportunities
Maturity redemption: pay 100% of face value if condition met; also pay 100% if not met (no principal loss)
This bond is not protected by the Deposit Protection Act; issuer credit risk exists (credit rating AA)
Issuance may be cancelled if total subscription amount is less than KRW 500 million; subscription period only on May 29, 2026
Proceeds will be used for hedging of underlying asset and investment in financial products
The issuance is negligible relative to market cap (~KRW 34.7 trillion) and has no material impact on shareholder value