Mirae Asset Securities issues two series of Equity-Linked Bonds (ELB) linked to Samsung Electronics common stock, totaling KRW 24.875 billion (Series 3977: KRW 9.95 billion, Series 3978: KRW 14.925 billion)
Series 3977: 3-year maturity, auto-call at 70% of initial price, annual yield 5.80%, principal protected with 70% knock-in barrier
Series 3978: 3-year maturity, monthly coupon of 0.495% (annual 5.94%) if underlying above 60% of initial, auto-call at 75%, 100% principal repayment at maturity
Issue price: KRW 9,950 per bond (face value KRW 10,000), non-listed, subscription limited to Hana Bank trust clients
Proceeds to be used for hedging and investment in financial products