Shinyoung Securities Files Supplementary Filing for 12 ELB Issues

Shinyoung Securities (credit rating AA-) submitted a supplementary filing for 12 tranches (Nos. 874-885) of Equity-Linked Bonds (ELB) to be issued on May 26, 2026
Underlyings: S&P 500, KOSPI200, Samsung Electronics, SK Hynix
Total offering per issue: ~USD 9.9-9.98M (foreign currency) or KRW 496.5-499.5B (Korean won)
Risk level: 'Somewhat High Risk' (4 issues), 'Normal Risk' (8 issues)
Structure: Non-principal protected (no knock-in), pays at least principal at maturity or upon autocall (but early redemption may incur loss)
Not listed on exchange; early redemption at ≥95% of fair value (≥90% within 6 months of issuance)
Not covered by deposit insurance; potential loss of principal
Proceeds used for hedging

Filing: Shelf Registration Supplementary Document (Derivative-Linked Bonds - Equity-Linked Derivative-Linked Bonds)
Company: Shinyoung Securities (001720)
Submission: Shinyoung Securities Co., Ltd.
Receipt: 05-14-2026