Daishin Securities Reports Issuance of 1094th ELB (Low Risk)

Daishin Securities completed the issuance of the 1094th Equity-Linked Bond (Low Risk) and submitted a performance report.
Actual funds raised were 2,998.5 billion KRW, only 60% of the initially filed planned amount of 4,997.5 billion KRW due to under-subscription.
Issue price per bond: 9,995 KRW, face value 10,000 KRW, 500,000 bonds issued, maturity 184 days (Nov 13, 2026).
Underlying asset: Samsung Electronics common stock; redemption yields: 3.190%–3.200% p.a. based on conditions.
Issuance cancellation clause (if total subscription < 1 billion KRW) was not triggered as actual raised amount was 2,998.5 billion KRW.
Hedging will be conducted by Daishin itself; most of the proceeds (2,998.35 billion KRW) will be used for hedging transactions.