Mirae Asset Securities to issue two series of Equity-Linked Bonds (ELBs) totaling KRW 22 billion, linked to KOSPI200 and Samsung Electronics (Series 3971: KRW 10bn, Series 3972: KRW 12bn)
Issuer credit rating AA, unsecured, not covered by deposit insurance
Series 3971: 546-day maturity (Nov 5, 2027), annual yield approx 3.58%, early redemption rates 1.58% or 2.58% depending on period
Series 3972: 236-day maturity (Dec 30, 2026), annual yield approx 3.33%, early redemption rate 2.33%
Proceeds to be used for hedging underlying assets and financial investments
Bonds unlisted, limited OTC liquidity, potential principal loss on early redemption