LG HelloVision Issues 170 Billion Won Unsecured Bonds for Debt Repayment and Working Capital
LG HelloVision decides to issue 170 billion won in unsecured bonds (Series 15-1 and 15-2): 160 billion for debt repayment, 10 billion for working capital.
Of the funds raised, 160 billion won will be used to repay existing borrowings (120 billion won of Series 12-2 bonds at 4.029% and 40 billion won of commercial paper at 2.970%, average rate approx. 3.76%).
The new bonds are scheduled to be listed on May 6, 2026, and the specific interest rate has not been disclosed yet.
In addition to the 10 billion working capital, a further 15.9 billion won is planned for equipment purchases (partially funded from internal resources).