Issuance of 4 equity-linked bonds linked to Samsung Electronics and NAVER worth 109.4 billion won
Decision to issue 4 equity-linked bonds (ELB series 1073-1076) totaling 109.45 billion won, underlying Samsung Electronics common stock (1073-1075) and NAVER common stock (1076), maturity May 16, 2029
Series 1073: 80% barrier auto-call, 5.90% p.a. coupon (pre-tax), principal protected (principal paid if below 80% at maturity), offering amount 19.9 billion won
Series 1074: Monthly coupon 0.4375% (5.25% p.a.), 80% barrier auto-call, principal protected, offering amount 29.85 billion won
Series 1075: Monthly coupon 0.49% (5.88% p.a.), 85% barrier auto-call, principal protected, offering amount 39.8 billion won
Series 1076: Monthly coupon 0.455% (5.46% p.a.), 85% barrier auto-call, principal protected, underlying NAVER, offering amount 19.9 billion won
Issue price 9,950 won per bond (face value 10,000 won), subscription period only on May 13, 2026, limited to Hana Bank trust department
All bonds unlisted, not covered by depositor protection, credit risk from issuer rating AA- (NICE)
Under shelf registration, total planned 2.5 trillion won, actual issued 2.312 trillion won, remaining 187.7 billion won