Daishin Securities Issues 19.98 Billion KRW Low-Risk Derivative-Linked Bond 1075th Series
Daishin Securities issues the 1075th series equity-linked derivative bond with Samsung Electronics common stock as underlying asset, totaling 19.98 billion KRW.
Each bond has an issue price of 9,990 KRW, a maturity of 181 days on October 22, 2026, offering an annual return of 3.10% to 3.11%.
The bond is not protected by the Depositor Protection Act and may incur principal loss upon early redemption before maturity.
The issuer Daishin Securities holds a AA- credit rating indicating stable financial condition.
[AI Summary]The routine issuance of a low-risk derivative bond for funding purposes has a neutral impact on share value. The low cost of funding and stable issuer profile present no significant downside risk.